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Visit Automated Packaging Systems

NACDS Marketplace 2008

June 28th – July 1st, 2008

San Diego Convention Center

San Diego, California

Booth #2006

 
Automated Packaging Systems will feature the latest in mail order fulfillment and protective packaging products at NACDS 2008. Visit us in Booth #2006 to see how our systems can increase your productivity while reducing your costs.
 
Product Spotlight
 

 

The AirPouch™ Express 3 is a portable, tabletop void-fill system capable of producing over 2,000 cubic feet of air pillows per shift. The unit weighs just 35 pounds, and features a small footprint to free-up valuable warehouse space. There is no need for compressed air – simply load and start packing.

The AirPouch Express 3 System uses DuraClear™ material and features superior sealing technology, resulting in better air retention and highly durable, puncture-resistant air pillows. EZ-Tear™ perforations, exclusive to AirPouch pillows, require an average of 83% less effort to pull and separate, and are preferred for their ergonomic handling.

The Express 3 is available with a variety of system options to optimize each unique application, including basic and overhead hoppers, product level sensors, and other accessories that maximize packing efficiency. AirPouch air pillows are available in a variety of sizes that offer high yield and reduced costs. 

  

About Us 

  

Automated Packaging Systems has been designing and manufacturing original Autobag®, AirPouch and SidePouch™ systems and products for more than 40 years. With more than 25,000 packaging systems in operation and a national service organization, Automated Packaging has the experience and support to deliver the ultimate in customer satisfaction. The company’s Systems Advantage™ Program combines machines, materials and services to further enhance the value of its packaging solutions. 

  

 
Not going to the show? Click here to request more information about our packaging systems and products. Be sure to ask for your free catalog CD with your request.

 
 
 
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